IIT Hyderabad, Mobis India tie up for joint research on advanced automotive technologies

IITH will use its expertise in Mathematical Modeling, Machine Learning, and Hardware prototypes to address India-specific challenges in ADAS.

IIT Hyderabad (Source: Official)IIT Hyderabad (Source: Official)

Vagisha Kaushik | March 16, 2022 | 01:55 PM IST

NEW DELHI: The Indian Institute of Technology (IIT) Hyderabad and Mobis India have collaborated on joint research in the field of advanced automotive technologies. IITH will use its expertise in the field of Mathematical Modeling, Machine Learning, and Hardware prototypes for ADAS to address India-specific challenges in Advanced Driving Assistance Systems (ADAS) and Hardware Resource Optimization techniques for Chassis Software.

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Expressing delight on this collaboration, Jae oh Cha, Chief Technical officer (CTO), said, “Mobis India Limited (Mobis Technical Centre of India) is happy to collaborate with IIT Hyderabad for future technology development in advanced driver assistance systems and Chassis systems for the Indian Automobile Market. We are looking forward to increasing the collaboration in the future”.

Speaking on occasion, Professor B S Murty, Director of IITH, said, “With this collaboration, IITH aims to further strengthen its expertise in the field of Automotive Industry, specific to Advanced Automotive Technologies like ADAS. This pact will enable our researcher to answer the unsolved challenges and equip IITH to prep industry-ready human resources with domain expertise to achieve our motto of inventing and innovating in technology for humanity”.

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Hyundai Mobis is a global Strategic business partner of Hyundai Motor Company (HMC) and Kia Motor Company in the areas of Advanced Automotive Modules, core automotive parts, and advanced automotive electronics systems. Mobis India Limited (Mobis Technical Centre in India -MTCI) which is one of the R&D Centre for Hyundai Mobis, works on various vehicle Infotainment, Mechatronics (Chassis, Safety, and Vision Systems), and CAE.

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