IIT Guwahati, Tata Electronics partner to establish Centre of Excellence for semiconductor research

The Indian Institute of Technology (IIT) Guwahati has signed an agreement with Tata Electronics Private Limited to set up a Centre of Excellence (CoE) on its campus to support semiconductor education, skill development and research. 

Addressing the collaboration with Tata Electronics, Devendra Jalihal, Director, IIT Guwahati, said, “This initiative aims to connect academic institutions, industry and students through specialised education, practical training and collaborative research. By identifying relevant institutions across Assam and supporting the development of semiconductor-focused curricula, the collaboration will broaden access to specialised technical education.”

The Memorandum of Understanding (MoU) signing will address the demand for skilled professionals in semiconductor manufacturing by introducing industry-focused courses and practical training programmes. It will also expand opportunities for students from engineering colleges, polytechnics and other educational institutions across Assam and the Northeast.

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IIT Guwahati MoU: Semiconductor research

Under the agreement, IIT Guwahati will lead the development and delivery of academic and training programmes in semiconductor ATMP. These will include diploma-level courses and engineering programmes, with practical training.

The partnership will also involve identifying engineering colleges, universities and polytechnics that can participate in semiconductor-focused education and training. Students from these institutions will get opportunities for hands-on learning and specialised training.

Both organisations will work together and prepare industry-based course materials and training resources. The initiative will also include training for faculty members from participating institutions to improve their teaching of semiconductor-related subjects.

The collaboration will provide training opportunities for students at Tata Electronics. Undergraduate and postgraduate students will also be able to participate in joint research projects related to semiconductor packaging, assembly, testing and other technologies.